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Ground bounce effects in dielectric and substrate coupling between IC interconnects
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CEAS--753.pdf (236.9Kb)
Author
Li, Tao
Zemanian, A. H.(Armen H.)
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URI
http://hdl.handle.net/1951/37237
http://hdl.handle.net/11401/65471
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Community Members' Scholarship [CEAS]
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