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Stony Brook Theses and Dissertations
Stony Brook Theses and Dissertations Collection
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Stony Brook Theses and Dissertations
Stony Brook Theses and Dissertations Collection
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Through-Silicon Via (TSV) Related Noise Coupling in Three-Dimensional (3-D) Integrated Circuits (ICs)
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Asgari_grad.sunysb_0771M_10782.pdf (7.341Mb)
Author
Asgari, Mohammad Hosein
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URI
http://hdl.handle.net/1951/59570
http://hdl.handle.net/11401/71144
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Stony Brook Theses and Dissertations Collection
[4009]
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